The outline of bump bond process steps. (1) deposition of field metal

PDF) GaAs array fabrication

A. Peacock's research works European Space Agency, Paris (ESA) and other places

PDF) GaAs array fabrication

Top: X-ray image of a standard sardine, shown in the lower image, taken

The outline of bump bond process steps. (1) deposition of field metal

Hans ANDERSSON, Principal Research Engineer

Left) A 64 x 64 pixel GaAs array produced to qualify the bump bonding

A. Peacock's research works European Space Agency, Paris (ESA) and other places

Left) A 64 x 64 pixel GaAs array produced to qualify the bump bonding

The outline of bump bond process steps. (1) deposition of field metal

PDF) GaAs array fabrication

PDF) GaAs array fabrication

Left) A 64 x 64 pixel GaAs array produced to qualify the bump bonding

Left) X-ray image of a line pair rule taken using an un-collimated

PDF) GaAs array fabrication